17 February 2011 05:23 [Source: ICIS news]
SAN DIEGO, California (ICIS)--US start-up company Bioformix has developed a high-speed, no-heat cure technology that can dramatically save energy and costs in adhesive and coatings application, its chief executive said on Wednesday.
The company’s technology is based on a di-substituted vinyl monomer platform, said Bioformix CEO Adam Malofsky, in an interview with ICIS on the sidelines of the Next Generation Bio-Based Chemicals Summit in San Diego.
“Our monomer family has been known for decades, but every previous attempt to commercialise them failed. Enabling discoveries by our company have now allowed for the chemistry’s full utilisation especially in adhesives and coatings,” said Malofsky.
Bioformix’s formulated polymers provide epoxy-like bonds with high-speed curing at an ambient temperature. By eliminating heat for adhesive and binder cure, the technology allowed for dramatic energy savings and the selection of lower-cost, non-heat resistant materials in products, said Malofsky.
The company’s monomer raw materials can also be sourced from either petroleum feedstock or direct fermentation from sugar.
Bioformix could now supply 100-1,000kg quantities if required, said Malofsky.
“Within the first three years, we expect to complete higher production scale strategic partnerships for both monomer and and polymer manufacture as well as application development,” he added.
The company was already working with several adhesive and coatings players as well as in the downstream markets, said Malofsky.
Bioformix is working with Ohio, US-based custom chemical manufacturer Shepherd Chemical for the production of di-substituted vinyl monomers. Shepherd Chemical is expected to initially produce the monomer in the low millions of dollars with global distribution capabilities, added Malofsky.
The Biobased Chemicals Summit ends Thursday.
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